Based on ATSAM3U2C chip (Datasheet):
- Cortex-M3 96 Mhz
- 128 KB Flash
- 36 KB RAM
- High-speed USB 2.0 device controller: up to 7 bi-directional endpoints including EP0 (*)
- LQFP100 packaging
(*) "up to 7 bidirectional Endpoints" (source: Datasheet](https://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-6430-32-bit-Cortex-M3-Microcontroller-SAM3U4-SAM3U2-SAM3U1_Datasheet.pdf))
| Region | Size | Start | End |
|---|---|---|---|
| Flash | 128 KB | 0x0000_0000 | 0x0001_0000 |
| SRAM | 32 KB | 0x2007_C000 | 0x2008_3FFF |
Bootloader size is 32 KB
| Signal | I/O | Symbol | Pin |
|---|---|---|---|
| SWD | |||
| SWCLK | O | PA17 | 14 |
| SWDIO | I/O | PA18 | 17 |
| nRESET | O | PA30 | 30 |
| UART | |||
| UART TX | O | PA12 | 41 |
| UART RX | I | PA11 | 40 |
| Button | |||
| NF-RST But. | I | PA25 | 24 |
| LEDs | |||
| HID LED | O | PA29 | 85 |
| MSD LED | O | PA28 | 84 |
| CDC LED | O | PA31 | 86 |
The SEGGER design suggests a change to the pin assignment of the TC2050-IDC used to debug the HIC MCU. They suggest replacing GNDDetect by power-supply (VBus, V5), which could create a short with standard Tag-Connect cables and SWD probes.
| Signal | I/O | Symbol | Pin |
|---|---|---|---|
| SWD / JTAG | |||
| SWCLK / TCK | O | PA17 | 14 |
| SWCLK / TCK | I | PA22 | 5 |
| SWDIO / TMS | O | PA18 | 17 |
| SWDIO / TMS | I | PA15 | 12 |
| TDI | O | PA20 | 19 |
| TDI | I | PA13 | 10 |
| SWO / TDO | I | PA21 | 20 |
| nRESET | O | PA4 | 30 |
| nRESET | I | PA3 | 29 |
| UART | |||
| UART TX | O | PA12 | 41 |
| UART RX | I | PA11 | 40 |
| Button | |||
| NF-RST But. | O | PA1 | 27 |
| NF-RST But. | I | PA0 | 26 |
| LEDs | |||
| LED1 | O | PA29 | 85 |
| LED2 | O | PA28 | 84 |