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Pad.kR rule vs openroad PAD #245
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Hi, so far we used the Bondpad GDS for all our Tapeouts and had never issues with wire- or flipchip bonding. Best |
Same errors here. I also have others which I think are coming from that bondpad as well :
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If |
I can confirm I also see |
That's interesting. @KrzysztofHerman Is there something wrong with our implementation / understanding of |
The "rejection test" thing on the web ui for submission definitely reports |
I have just run the |
@akrinke the detection of this violation is seems to be correctly implemented. Nevertheless maybe we could think about additional section in the rules related to |
@britovski going back to your concern about the |
It is already defined as a recommendation. If you run the maximal DRC script with |
@smunaut, could you please send an email with the attached report? |
one more comment regarding the "rejection test" thing on web ui reports
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the |
Environment
klayout 0.29.7
Expected Behavior
DRC clean?
Actual Behavior
144 Pad.kR rule violations
Steps to Reproduce the Problem
I saw that is an expressed rule on SG13G2_os_layout_rules manual that says: "TopVia2 under Pad not allowed (Note 3)"
Note 3. TopVia2 may be damaged during packaging process, we recommend not to use them below Passiv.
The openroad PAD has stacked all metal layers to easy the connections from the chip but how can deal with the note 3 about the violation?
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