- Central controller or distributed controller.
- May be a mother board to combine all the modules or each module may be assembled separately.
- As the PCB gets smaller, the routing of PCB traces becomes very difficult to realize a circular shape design and meanwhile maintain low parasitic inductances.
- Half bridge should be a building block for modularity. Will be better in terms of parasitic inductance, switching performance and heat dissipation.
- An example of modularity is shown:
- Test with RL load at steady state
- Test with RL load at with transients
- Test with a rewounded motor
- Test with a designed motor
- Rewound example:
- LC filter for PWM mismatch
- Half bridge X phase X module. If there are three phases and 4 modules, there will be 12 half bridges.
GAN: http://epc-co.com/epc/Portals/0/epc/documents/datasheets/epc2001c_datasheet.pdf
- Dual gate driver for each.
DRIVER: http://www.ti.com/lit/ds/symlink/lm5113.pdf
- Heat sink, Fan
- DC link capacitor for each
- One controller card with DSP (enough number). Display. Communication interface. Programming port. Encoder. ADC inputs.
An example is shown:
- Motherboard where all componenets are assembled:
- An overall control algorithm (indifect field oriented control):
http://www.transphormusa.com/document/recommended-external-circuitry-transphorm-gan-fets/ http://www.transphormusa.com/document/printed-circuit-board-layout-probing-gan-fets/