openMEMSdesign:

various open source and reverse engineering MEMS layouts

pressure sensor

simple CMOS pressure sensor	pressure_sensor

resonators

• claped-clamped beam microresonator in BDRIE, see documentation here

Tang_resonator	resonator

accelerometers

uni_axial_polysilicon_accelerometer	bulk micromachined uni_axial accelerometer	TPU_accelerometer	uniaxial_BDRIE_accelerometer

gyros

RR-gyro	LL-gyro

IMU

• Model of an MPU-6050 6 axis accelerometer/gyroscope

micromirrors

LMGT 2D micromirror	micromirror	cascaded micromirror

compliant mechanisms

• Sperrklinke
• mechanical_amplifier
• indenter
• Schrittschaltwerke

Schrittschaltwerke

piezoelectric circuits

• https://www.i-micronews.com/products/qorvo-qm76018-rffem-in-the-apple-iphone-xr/
• Baw filter structure with internal electrostatic shielding, US20190103851A1

test structures

• http://www-tcad.stanford.edu/~chan/mems/canonical/data_files/layout.gds
• Hall_structures
• piezoresistive_structures

microfluidics / BioMEMS

• microfluidic_mixer

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commercial MEMS processed:

• X-FAB: XMS10 and XMB10
• TUC ZfM:
  • AIM (Airgap Insulation of Microstructures)
  • SCREAM (Single Crystal Reactive Etching and Metallization)
  • BDRIE (Bonding and Deep Reactive Ion Etching), 40-50um thick device layer
• IMEC: SiGeMEMS
• STMicroelectronics: ThELMA (Thick Epitaxial Layer for Microactuators and Accelerometers)
• Tronics/TDK: HARM
• GE: Polaris (5 mask layers with WLP and TSV, 100um thick device layer, 10x10mm area image)