Update actions products

doc/gen/README.md

@@ -0,0 +1,113 @@
+# PCB
+
+Board size: 50.29x40.13 mm (1.98x1.58 inches)
+
+- This is the size of the rectangle that contains the board
+- Thickness: 1.6 mm (63 mils)
+- Material: FR4
+- Finish: HAL
+- Layers: 2
+- Copper thickness: 35 µm
+
+Solder mask: TOP / BOTTOM
+
+- Color: Green
+
+Silk screen: TOP / BOTTOM
+
+- Color: White
+
+
+# Important sizes
+
+Clearance: 0.2 mm (8 mils)
+
+Track width: 0.2 mm (8 mils)
+
+- By design rules: 0.2 mm (8 mils)
+
+Drill: 0.5 mm (20 mils)
+
+- Vias: 0.5 mm (20 mils) [Design: 0.4 mm (16 mils)]
+- Pads: 1.0 mm (39 mils)
+- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
+
+Via: 0.8/0.4 mm (31/16 mils)
+
+- By design rules: 0.4/0.3 mm (16/12 mils)
+- Micro via: yes [0.2/0.1 mm (8/4 mils)]
+- Buried/blind via: yes
+- Total: 20 (thru: 20 buried/blind: 0 micro: 0)
+
+Outer Annular Ring: 0.15 mm (6 mils)
+
+- By design rules: 0.26 mm (10 mils)
+
+Eurocircuits class: 4B
+- Using min drill 0.5 mm for an OAR of 0.15 mm
+
+
+# General stats
+
+Components count: (SMD/THT)
+
+- Top: 0/18 (THT)
+- Bottom: 5/0 (SMD)
+
+Defined tracks:
+
+- 0.3 mm (12 mils)
+- 0.4 mm (16 mils)
+- 0.5 mm (20 mils)
+- 0.6 mm (24 mils)
+- 0.7 mm (28 mils)
+- 0.8 mm (31 mils)
+
+Used tracks:
+
+- 0.2 mm (8 mils) (13) defined: no
+- 0.3 mm (12 mils) (6) defined: yes
+- 0.4 mm (16 mils) (11) defined: yes
+- 0.6 mm (24 mils) (85) defined: yes
+- 0.8 mm (31 mils) (45) defined: yes
+
+Defined vias:
+
+
+Used vias:
+
+- 0.8/0.4 mm (31/16 mils) (Count: 20, Aspect: 2.0 A) defined: no
+
+Holes (excluding vias):
+
+- 0.89 mm (35 mils) (32)
+- 1.0 mm (39 mils) (12)
+- 3.0 mm (118 mils) (4)
+- 3.25 mm (128 mils) (4)
+
+Oval holes:
+
+
+Drill tools (including vias and computing adjusts and rounding):
+
+- 0.5 mm (20 mils) (20)
+- 1.0 mm (39 mils) (32)
+- 1.1 mm (43 mils) (12)
+- 3.1 mm (122 mils) (4)
+- 3.35 mm (132 mils) (4)
+
+Solder paste stats:
+
+Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³
+and 1.0 g/cm³ for the flux. This paste has an specific gravity of  4.15 g/cm³.
+
+The stencil thickness is  0.12 mm.
+
+| Side   | Pads with paste | Area [mm²] | Paste [g] |
+|--------|-----------------|------------|-----------|
+| Total  |              16 |       8.80 |      0.04 |
+
+Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.
+
+
+