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Modified YAMLs matter 1.3 #32116
Modified YAMLs matter 1.3 #32116
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modifications as per verfication step document issue project-chip#122
modifications in logs for step 1, 3, 5 as verification step document changes issue project-chip#125
modification for step 13a (From DRLK.S.F0b && DRLK.S.A0015 to DRLK.S.F0b && DRLK.S.A0016) as per test plan changes issue project-chip#128
In step 1a and 3 supportedLocales attribute PICS has to be updated LCFG.S.A0001 instead LCFG.S.A0000 as per test plan issue project-chip#129
TC-APPLAUNCHER-3.7.1, TC-APPLAUNCHER-3.8.1 and TCAPPLAUNCHER-3.9.1 was updated as per verification step document (DUT as Client) issue project-chip#139
PR #32116: Size comparison from a95c3d5 to f61f53a Full report (4 builds for cc32xx, mbed, stm32)
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PR #32116: Size comparison from a95c3d5 to 8e5662a Full report (19 builds for cc13x4_26x4, cc32xx, k32w, mbed, nrfconnect, qpg, stm32)
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command and logs has been updated as per verification step document for all steps
command has been updated as per verification step document
…nnectedhomeip into Modified_yamls_matter_1_3
Added TC-LWM-1.1, TC-TCCM-1.1 TC-DISHM-1.1, TC-DISHM-3.1, TC-DISHM-3.3 TC-ICDM-3.4 TC-CNET-4.9, TC-CNET-4.10, TC-CNET-4.11 TC-TCCM-3.1, TC-TCCM-3.3 TC-LWM-3.1, TC-LWM-3.3 TC-OTCCM-1.1, TC-OTCCM-2.1 TC-S-3.1 |
PR #32116: Size comparison from a95c3d5 to 9bc6ed6 Full report (3 builds for cc32xx, stm32)
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command has been updated in precondition as per verification step document
…nnectedhomeip into Modified_yamls_matter_1_3
PR #32116: Size comparison from a71f814 to 681ca3c Decreases (1 build for efr32)
Full report (73 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, stm32, telink)
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PR #32116: Size comparison from de5c6d5 to 8b57258 Decreases (1 build for efr32)
Full report (73 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, stm32, telink)
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PR #32116: Size comparison from de5c6d5 to 9ea636d Increases above 0.2%:
Increases (70 builds for bl602, bl702, bl702l, cc13x4_26x4, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, stm32, telink)
Decreases (5 builds for cc32xx, psoc6)
Full report (73 builds for bl602, bl702, bl702l, cc13x4_26x4, cc32xx, cyw30739, efr32, esp32, k32w, linux, mbed, nrfconnect, psoc6, qpg, stm32, telink)
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Fix issues: project-chip/matter-test-scripts#119, project-chip/matter-test-scripts#122, project-chip/matter-test-scripts#125, project-chip/matter-test-scripts#128, project-chip/matter-test-scripts#129, project-chip/matter-test-scripts#139, project-chip/matter-test-scripts#140, project-chip/matter-test-scripts#141