Urukul heat sink

[jordens]

Back side
Exposed copper
See note in #291

[dhslichter]

Solder mount?

[gkasprow]

There are tiny copper heatsinks that can be placed by P&P machine and reflow soldered. I will leave bottom part of thermal pad exposed. Anyway, one should not cover vias from one side because it creates pockets so would leave them open anyway.
So when needed, we can easily solder such heatsink.

[dhslichter]

Are you not planning to use epoxy-filled vias under the DDS chips? From what I understand, assembly and exposed paddle solder joint quality/reliability are considerably better if the vias are filled, rather than empty or soldermask-tented.

[gkasprow]

We will use soldering paste on both sides and let it flow in and fill vias entirely, It has much better characteristics than epoxy. Guys who do assembly know how to control the process to have the vias filled with tin..

[gkasprow]

I added enlarged, exposed pad on bottom layer, covered with solder paste. This should increase effective heat dissipation area. In case of troubles, we will solder copper pads that would further increase the area.