FEM Models (Ansys APDL) for electromigration, thermal migration, and stress migration in AC interconnects.
Contact: susann.rothe(at)mailbox.tu-dresden.de https://www.ifte.de/english/staff/rothe.html
S. Rothe, J. Lienig "Combined Modeling of Electromigration, Thermal and Stress Migration in AC Interconnect Lines," Accepted for publication at the International Symposium on Physical Design (ISPD), 2023
The models are based on the previous work of Dr. Steve Bigalke: S. Bigalke, J. Lienig "Avoidance vs. Repair: New Approaches to Increasing Electromigration in VLSI Routing," Integration, the VLSI Journal, vol. 65, https://doi.org/10.1016/j.vlsi.2020.04.009, July 2020.