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- Fixed parts availability ISSUE #38 - In FPGA_SDRAM.SchDoc NCP51145PDR2G changed to NCP51200MNTXG ISSUE #39 - In EEM_Connectors_JTAG.SchDoc I2C enabling IC added ISSUE #40 - In Power_Supplies.SchDoc IC14 enabled in EEMvariant, R278 changed to Schottky diode. ISSUE #43 - R80 and R79 changed to 1k, added DIP switch ISSUE #44 - In IC2 pins 6 and 7 disconected ISSUE #45 - In IC10 GPB7 and GPB0 swapped ISSUE #46 - Board shape change, left LEDs SMA mounting holes, right connectors, J10, J11 moved, SMA changed to delock #47 - R3 changed to 1k ISSUE #48 - Board extended from panel side, LD15 changed ISSUE #49 - Migration from 100T to 200T ISSUE #51 - C103 changed to 680u - 4.7uF caps in VCCINT increased amount from 6 to 12 - 470nF caps in VCCINT increased amount from 8 to 14 - 470nF caps in VCCBRAM increased amount to from 2 to 3 - Pin delays in 200T added - FMC position fixed ISSUE #52 - LVDS diffpairs adjusted - GND vias added near LVDS that changes reference - vias moved under L26 - On L2 polygon under diff pairs changed (12V, 3V3) - Impedance control added - DDR trace width unified to meet impedance control requirements - Front panel 3D model updated - Variants updated - PDN simulation added
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Michał Piętka
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Nov 16, 2023
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