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- Fixed parts availability ISSUE #38
- In FPGA_SDRAM.SchDoc NCP51145PDR2G changed to NCP51200MNTXG ISSUE #39
- In EEM_Connectors_JTAG.SchDoc I2C enabling IC added ISSUE #40
- In Power_Supplies.SchDoc IC14 enabled in EEMvariant, R278 changed to Schottky diode. ISSUE #43
- R80 and R79 changed to 1k, added DIP switch ISSUE #44
- In IC2 pins 6 and 7 disconected ISSUE #45
- In IC10 GPB7 and GPB0 swapped ISSUE #46
- Board shape change, left LEDs SMA mounting holes, right connectors, J10, J11 moved, SMA changed to delock #47
- R3 changed to 1k ISSUE #48
- Board extended from panel side, LD15 changed ISSUE #49
- Migration from 100T to 200T ISSUE #51
- C103 changed to 680u
- 4.7uF caps in VCCINT increased amount from 6 to 12
- 470nF caps in VCCINT increased amount from 8 to 14
- 470nF caps in VCCBRAM increased amount to from 2 to 3
- Pin delays in 200T added
- FMC position fixed ISSUE #52
- LVDS diffpairs adjusted
- GND vias added near LVDS that changes reference
- vias moved under L26
- On L2 polygon under diff pairs changed (12V, 3V3)
- Impedance control added
- DDR trace width unified to meet impedance control requirements
- Front panel 3D model updated
- Variants updated
- PDN simulation added
The FMC extends beyond the EFC panel.
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